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RESIST TWG Meetings



February 26, 2017
1 Resist challenges and potential research areas by Oktay Yildirim, ASML
2 EUV resists: When more may be less by Anna Lio, Intel
3 IBM EUV resist-metal hardmask interactions by Dario Goldfarb, IBM
4 Shot noise, LER and limitations of current EUV photoresists by Anindarupa Chunder, GlobalFoundries
5 Resist exposures with low energy electrons by Ruud Tromp, IBM
6 Electrons and holes in the EUV exposure mechanism by Robert Brainard, SUNY Poly
7 Stochastics across wavelength by Alex Vaglio Pret, KLA-Tencor
8 Relationship between photon shot noise and secondary electron blur in line edge roughness formation by Takahiro Kozawa, Osaka University
9 Nanoparticle EUV photoresist studies by Kazuki Kasahara, JSR/Cornell University
10 Multi trigger resist by Alex Robinson, University of Birmingham
11 Positive and negative tone crosslinked organic molecular resists: An update and outlook by Cliff Henderson, University of South Florida
12 Comparison of EUV and electron reactivity for metal oxalate photoresists by Greg Denbeaux, SUNY Poly


October 23, 2016
1 TWG Agenda by Yu-Jen Fan, Globalfoundries/SUNY
2 EUV Resist Stochastics by Anna Lio, Intel
3 Understanding patterning variability: The Multivariate Poisson Propagation Model by Patrick Naulleau, CXRO LBNL
4 Fundamental aspects of RLS trade-off and photon shot noise of CAR and PSCAR by Seiichi Tagawa, Osaka University
5 Analysis of metal resist used for extreme ultraviolet lithography by Takahiro Kozawa, Osaka University
6 Update of resist outgas testing at EIDEC by Eishi Shiobara, EIDEC
7 Development status of patterning enhancement material for EUV lithography by Kazuma Yamamoto, Merck
8 Gas phase synchrotron experiments probing EUV resist photochemistry by Frank Ogletree, LBNL
9 Photoelectron scattering and uncertainty in acid release in EUV by John Biafore, KLA-Tencor
10 The role of secondary electrons in EUV resist exposure mechanisms by Greg Denbeaux, CNSE SUNY Poly


February 21, 2016
1 TWG Agenda by Yu-Jen Fan, SUNY Poly SEMATECH
2 Recent progress in nanoparticle photoresist development for EUV lithography by Kazuki Kasahara, Cornell University/JSR
3 RECENT DEVELOPMENT STATUS OF EUV RINSE by Tatsuro Nagahara, EMD Performance Materials
4 Accelerating Fab Integration of Metal Containing Resists by Jason Stowers, Inpria
5 ADVANCES IN ALTERNATIVE PHOTO MATERIALS FOR HVM EUV LITHOGRAPHY by DANILO DE SIMONE, imec
6 Status update on outgassing of alternative resists by Gijsbert Rispens, ASML
7 Update of Resist Outgas Testing at EIDEC by Eishi Shiobara, EIDEC
8 Considerations for resist outgas testing with EUV and hydrogen at NIST by Shannon Hill, NIST
9 IBM Outgas Update by Dario L. Goldfarb, IBM
10 Fundamental aspects of sensitivity enhancement and RLS trade-off of chemically amplified EUV resist by Seiichi Tagawa, Osaka University
12 Molecular resists for EUV lithography by Alex P.G. Robinson, University of Birmingham
13 Is an EUV Film Quantum Yield of 30 Possible? by Greg Denbeaux, SUNY Polytechnic Institute
14 What Don’t We Know About EUV Exposure Mechanisms? by Robert L. Brainard, SUNY Polytechnic Institute
15 IEUVI Resist TWG Summary by Yu-Jen Fan, SUNY Poly SEMATECH



October 4, 2015
1 TWG Agenda by Yu-Jen Fan, SEMATECH
2 Resist Performance Review and Requirements Discussion by Yu-Jen Fan, SEMATECH
3 Cross Section of EUV PAGs: Influence of Concentration, Electron Energy, and Structure by Greg Denbeaux, CNSE SUNY Poly
4 DDR Process for Advanced Patterning Technology by Rikimaru Sakamoto, Nissan Chemical
5 EUV Resist by Andrew Grenville, Inpria
6 Alternative EUV Materials at IMEC by Danilo De Simone, imec
7 EUREKA: A New Industry EUV Research Center at LBNL by Patrick Naulleau, CXRO LBNL
8 Outgassing of CAR and Alternative Resist: The Way Forward by Gijsbert Rispens, ASML
9 Update of Resist Outgas Testing at EIDEC by Eishi Shiobara, EIDEC
10 A Plan to Measure EUV Resist Contamination in the Presence of Hydrogen by Robert Berg, NIST



February 22, 2015
1 Welcome and Introductions by Yu-Jen Fan, SEMATECH
2 Resist Outgassing Spec Relaxation by Noreen Harned, ASML
3 EIDEC Outgas Testing Update by Eishi Shiobara, EIDEC
4 Imec Update on Outgas Qualification by Ivan Pollentier, imec
5 NIST Outgas Testing Update by Robert Berg, NIST
6 Effect of Witness Sample Roughness on Outgas CG Measurements by Shannon Hill, NIST
7 SEMATECH Outgas Update by Yu-Jen Fan, SEMATECH
8 New Process and Material Proposal for Next Generation Lithography by Wataru Shibayama, Nissan Chemical
9 Process Enhancement of EUV Materials by Shinji Tarutani, Merck
10 Understanding Electron Loss Mechanisms in EUV Resist using EELS and First-principles Calculations by Robert Bartynski, Rutgers University
11 Measurements of PAG Cross Section to Low Energy Electrons by Greg Denbeaux, CNSE
12 Summary by Yu-Jen Fan, SEMATECH



October 6, 2013
1 2013 TWG Introduction by Frank Goodwin, SEMATECH
2 NIST Resist Testing Update by S. Hill, NIST
3 EIDEC Outgas Testing Update by Soichi Inoue, EIDEC
4 ROX Outgassing Update by Greg Denbeaux, CNSE
5 IMEC Update on Resist Outgassing by Ivan Pollentier, IMEC
6 SEMATECH Outgas Testing Update by S. Sohn, Sematech
7 Outgas Round Robin Test by Karen Petrillo, Sematech
8 Molecular Organometallic Resists for EUV (MORE) by Brian Cardineau, CNSE
9 Time Resolved Spectroscopy of Nanoparticle EUV Photoresists by Seiichi Tagawa, Osaka University
10 Development of Block Copolymer Systems for DSA by Idriss Blakey, University of Queensland
11 IEUVI Resist TWG Summary by Greg Denbeaux, CNSE



February 24, 2013
1 2013 TWG Introduction by Karen Petrillo, SEMATECH
2 NIST Resist Testing Update by S. Hill, NIST
3 EIDEC Outgas Testing Update by Toshiya Takahashi, EIDEC
4 ROX Outgassing Update by Greg Denbeaux, CNSE
5 IMEC Update on Resist Outgassing by Ivan Pollentier, IMEC
6 Outgas Testing Update by Rupert C. C. Perera, EUV Tech
7 Use of DSA to Retify LCDU of EUV Contact Holes by Roel Grondheid, IMEC
8 BCP DSA for Contact Hole Shrink by R. Tiron, LETI
9 IEUVI Resist TWG Summary by Karen Petrillo, Sematech



September 30, 2012
IEUVI Resist TWG Agenda by Karen Petrillo, SEMATECH
NIST resist testing update by C. Tarrio, NIST
EIDEC Outgas Testing Update by Toshiya Takahashi, EIDEC
Witness plate outgassing update in Albany by Greg Denbeaux, CNSE
IMEC Update on Resist Outgassing Qualification by Ivan Pollentier, IMEC
Recent Developments in Construction of Resist Testing Tools for the NXE Platform by Rupert C. C. Perera, EUV Tech
Sept 2012 Resist TWG Survey Results by Karen Petrillo, SEMATECH
Simulating resist stochastics and performance optimization with PROLITH X4.1 by John J. Biafore, KLA/Tencor
Resist Improvements needed for EUVL Extension by Mark Neisser, Sematech



February 12, 2012
2012 IEUVI Resist TWG and Agenda by Karen Petrillo, SEMATECH

Presentations
Comparison of Resist Out-gassing Testing with EUV and E-gun exposure; RGA and WS by Rupert Perera, EUV Technology
Outgas Testing Update on EUV Light vs. Electron beam by Toshiya Takahashi, EIDEC
Update on Resist outgassing qualification towards NXE3100 by Roel Gronheid, IMEC
Update on NIST resist-outgas testing program by Shannon Hill, NIST
CNSE ROX Outgassing Tool - Current Status by Greg Denbeaux, CNSE
Line Width Roughness Control for EUV Patterning by Shinichiro Kawakami, TEL
Frequency response to smoothing techniques in EUVL by Alessandro Vaglio Pret, IMEC
Current Status of Inorganic Nanoparticle Photoresists by Christopher Ober, Cornell University
LER Degradation vs. EUV Resist Thickness by Robert Brainard, CNSE



October 20, 2011
2011 IEUVI Resist TWG and Agenda by Karen Petrillo, Patrick Naulleau and Serge Tedesco, SEMATECH

Presentations
E-beam and EUV Lithography Performance Comparison by Greg Wallraff, IBM
Outgas from EUV Resist Materials Irradiated with EUV and 2 keV Electrons by Seiichi Tagawa, Osaka University
Outgas Research Activity in EIDEC by Soichi Inoue, EIDEC
E-beam and EUV Lithography Performance Comparison by Noreen Harned, ASML
Witness Sample Based Resist Outgas Test Report
CNSE ROX Outgassing Tool by Greg Denbeaux, CNSE
NIST witness-plate testing by Charles Tarrio, NIST
Update on EUV Outgassing at IMEC by Ivan Pollentier, IMEC
EUV resist outgassing and witness plate contamination testing tool RER-300PEX by Rupert Perera, EUV Technology



February 27, 2011
2011 IEUVI Resist TWG Agenda by Karen Petrillo, SEMATECH

Presentations
2011 Resist TWG Introduction by Karen Petrillo, SEMATECH
EUV Resists Considered as Materials for Optics by Tom Wallow, GLOBALFOUNDRIES
Resist process and Etch process techniques for LWR reduction by Shinichiro Kawakami, TEL
Development of Under Layer material for EUV Lithography by B.C. Ho, Nissan
EUV resist outgassing update by Greg Denbeaux, CNSE
Development of Under Layer material for EUV Lithography by I. Pollentier, IMEC
NIST programs in photoresist outgassing and optics damage by C. Tarrio, NIST



October 17, 2010
2010 Resist TWG Intro and Agenda by Karen Petrillo, SEMATECH

Presentations
Trade-off Problems among Resolution, LWR and Sensitivity of EUV Resists by Seiichi Tagawa, Osaka University
EUV resist challenges of image collapse, LWR, sensitivity, and resolution by Jim Thackeray, DOW
EUV Resist Development toward 22nmhp Design and Beyond by Toru Kimura, JSR
Approaches to address the EUV resist challenges of image collapse, LWR, sensitivity, and resolution by Shinji Tarutani, Fuji
AZ EUV UL Overview by Mark Neisser, AZ
Tooling to measure EUV resist outgassing and witness plate contamination by Rupert Perera, EUV Technology
Witness Plate Testing and electron versus EUV outgassing by Greg Denbeaux, CNSE
Resist Outgas Testing by Noreen Harned, ASML



February 26, 2009
Welcome, Agenda, & Focus topic: Addressing Pattern Collapse in EUV by Jacque Georger, SEMATECH

Presentations
Challenges Associated with Line Pattern Collapse for EUV Lithography by Steve Scheer, Tokyo Electron America
EUV Resist Pattern Collapse Status by Chawon Koh, SEMATECH
Resist Pattern Collapse & Failure: Quantifying the Problem & Ways to Solve It by Clifford Henderson, Ga. Tech. Univ.
How and Why Does Pattern Collapse Occur? by Jun Iwashita, TOK
Resist Materials Issues Beyond 22nm hp Patterning for EUV Lithography by Shinji Tarutani, Fujifilm
Resist Outgassing WG Intro by Emil Piscani, SEMATECH
OS1 Resist Outgassing Results at Multiple Sites by Chimaobi Mbanaso, CNSE


October 02, 2008
Welcome & Agenda by Serge Tedesco, CEA/LETI
Focus Topic Intro: What are Keys to Optimizing RLS? by Jacque Georger, SEMATECH

Presentations
Resist Based Dose Calibrations Update by Noreen Harned, ASML
Optimizing RLS by Seiichi Tagawa, Osaka Univ./JST-CREST
Fullerene Resists - Optimizing RLS by Alex Robinson, Univ. of Birmingham
Optimizing RLS by Naoto Ohshima, FujiFilm EM
RLS Trade-Off: Questions about Molecular Size & Quantum Yield by Robert Brainard, CNSE, U. Albany
RLS Optimization KLUP to Understand Trends by Mieke Goethals, IMEC
Optimizing RLS by Todd Younkin, Intel


February 28, 2008

Presentations
Agenda, Introduction by K. Dean, SEMATECH and S. Tedesco, CEA/LETI
Tool Dose Calibration by P. Naulleau, LBNL
Shot Noise by C. Szmanda, Rohm and Haas
Shot Noise by G. Gallatin, Applied Math Solutions
Shot Noise by Y. Gotkis, KLA-Tencor
Shot Noise by R. Bristol, Intel
Shot Noise by H. Smith, MIT
Shot Noise by F. Pease, Stanford


November 01, 2007
Agenda

Presentations
Welcome, Introductions
Resist Technical Working Group by K. Dean
IMEC Update by A M Geothals
Brewer Science by J. Makos
Dynamics of Chemical Intermediates in CARs of Post-optical Lithographies by A. Saeki
Update from More Moore by S. Tedesco
Regional Update Selete by T. Itani
Regional Update Selete by K. Dean
Albany EUV MET by D. Stark
EUV Exposure Tool by J. Hartley
EUV Interference Lithography at PSI by H. Solak
Tool Dose Calibration by R. Brainard
Required Resist Performance for 32, 22 & 16nm hp based on a single Figure of Merit by K. Van Ingen Schenau
Wrap Up by S. Tedesco


March 01, 2007
Agenda

Presentations
Japan Update By I. Nishiyama, ASET
IMEC Update By R. Gronheid, IMEC
More Moore Update By K. Tedesco, CEA/LETI
US Update By K. Dean, Sematech
Tool Dose Calibration By R. Brainard, University of Albany
22nm Resist Development By T. Kozawa, Osaka University
LER/LWR Measurements By P. Naulleau, LBNL/University at Albany
Resist Specification Roadmap Dicussion By K. van Ingen Schenau, ASML
Wrap Up By S. Tedesco, CEA/LETI


October 19, 2006
Agenda

Presentations
International EUV Initiative Resist Technical Working Group By K. Dean
Review of Resist Outgassing Round Robin & Some Comments By I. Nishiyama
Wrap Up By S. Tedesco
U.S. & Sematech Update By K. Dean
EUV Resist Funding Gap Analysis By K. Dean
Measurements of HC Levels in Stepper Vacuums By A. Keen
New Method for Resist Outgassing Qualification By B. Wolschrijn
Acceptable Photoresist Outgassing By T. Aoki
Witness Plate Testing: the convergence of resist outgassing & optics contamination By G. Denbeaux
Contamination Removal of EUVL Masks & Optics Using 13.5-nm & 172-nm Radiation By T. Watanabe
Dose Calibrations for EUV Exposure Tools By R. Brainard



February 23, 2006
Agenda

Presentations
8th International EUV Initiative Resist Technical Working Group By K. Dean, S. Tedesco
Outgassing Measurement in the University of Hyogo (NewSUBARU) By T. Watanabe, H. Kinoshita
Comments on Resist Outgas Measurements to remove the confusion in outgassing discussion By I. Nishiyama
ASET Update for IEUVI Resist TWG meeting By H. Oizumi
Status of ASET-Outgassing evaluation By H. Oizumi
IEUVI Resist TWG By M. Goethals
Update from More Moore By S. Tedesco
University of Wisconsin EUV Exposure Stations By P. Nealey
EUV Resist Specification Roadmap By Hah (Samsung)
EUV Resist Screening Data Table By Leeson (Intel)
TOK Resist Development Status for EUV Lithography By K. Ohmori
IEUVI TWG Update-Resist Evaluation By T. Wallow, B. Lafontaine
Electrodelss Z-Pinch EUV source for Resist Outgassing & Exposure Studies By P. Blackborow
Tools for "In-House" Resist Characterization under EUV exposure By C. Wies, R. Lebert
EUV Stimulated Photoresist Outgassing By C. Hughes
Brief Regional Update: MEDEA Excite project By M. Goethals



November 10, 2005
Agenda

Presentations
Welcome & Introductions of Charter, Goals for Resist TWGs By Dean
Outgassing Round Robin Results By Intel/Yeuh
Outgassing Round Robin Results By H. Oizumi
Outgassing Round Robin Results By C. Vannuffel
Resist Round Robin Outgassing @ ELETTRA By M.Bertolo, P. Lacovig, L. Rumiz, D. Giuressi, R. Sergo, A. Stolfa
Update Japan/ASET By H. Oizumi, ASET
Update from More Moore By S. Tedesco
Update from MEADE/EXCITE By M. Goethals
Update from US/SEMATECH By K. Dean
New Areas for TWG Cooperation By S. Tedesco
Feedback on the ITWG Resist consortia cooperation proposal By P. Zanbergen
EUV Resist Specification Roadmap - Revised
IEUVI Resist Technical Working Group By A. Keen



March 03, 2005
Agenda

Presentations
IEUVI Resist Summary for March 4 IEUVI Meeting By Dean
Introduction to March 3 IEUVI Resist TWG Meeting By Dean
Feedback from 1st European on Resist LimitaionsBy Wolf-Dieter Domke, Infineon
Feedback from SEMATECH LER & Resist Limitation Workshops By Kim Dean
Brief Description of Outgassing Methods (5 min each) By Domke
Brief Description of Outgassing Methods (5 min each) By Keen
Brief Description of Outgassing Methods (5 min each) By Vannuffel
Brief Description of Outgassing Methods (5 min each) By Nishiyama
Brief Description of Outgassing Methods (5 min each) By Dean
Outgassing Discussion Notes By Dean
Resist Outgassing; compare methods & explore areas of cooperation By Wolf-Dieter Domke
Revised Resist Specifications By Dean
Update Japan/ASET By Iwao Nishiyama, ASET
Update from More Moore By Serge Tedesco, CEA/LETI
Update from MEADEA/EXCITE By Wolf-Dieter Domke
Update from US/SEMATECH By Kim Dean
Three Topics for TWG Cooperation By Serge Tedesco
Comparison of Resist Performance at LBNL Microstepper & PSI Interference Setup By Roel Gronheid



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